USB 3.1: Ανακοινώθηκε το επόμενο πρότυπο USB με ταχύτητα μέχρι 10Gbps

02 Αυγούστου 2013 Techgear Team

USB 3.1: Ανακοινώθηκε το επόμενο πρότυπο USB με ταχύτητα μέχρι 10Gbps


To USB 3.0 Promoter Group μας αποκαλύπτει ότι το επόμενο πρότυπο USB θα ονομάζεται USB 3.1 και οι ταχύτητες μεταφοράς δεδομένων του θα αγγίζουν τα 10Gbps. Το νέας γενιάς πρότυπο θα προσφέρει διπλάσιο bandwidth από το USB 3.0 και θα διατηρεί συμβατότητα με τις συνδέσεις USB 2.0.

Το νέο πρότυπο είναι σχεδιασμένο να συνυπάρχει με τις προδιαγραφές του USB Battery Charging 1.2, ενώ λειτουργεί εξίσου καλά με τις παραδοσιακές USB 2.0 συνδέσεις αλλά και το πρότυπο SuperSpeed USB 3.0. Πρός το παρόν δε γνωρίζουμε πότε θα είναι έτοιμες οι πρώτες USB 3.1 συσκευές αλλά τα πρώτα developers sessions θα ξεκινήσουν στις 21 Αυγούστου. Θυμίζουμε ότι μέσα στη χρονιά η Intel αναμένεται να παρουσιάσει και το Thunderbolt 2 με τις ταχύτητες του ανταγωνιστικού προτύπου να φτάνουν τα 20Gbps.

Ακολουθεί το επίσημο δελτίο τύπου:

SuperSpeed USB 10 Gbps – Ready for Development

USB 3.0 Promoter Group announced availability of the USB 3.1 Specification to increase
SuperSpeed USB to 10 Gbps

HILLSBORO, Ore. – July 31, 2013 – The USB 3.0 Promoter Group today announced the
completion of the USB 3.1 Specification which adds enhancements to enable SuperSpeed
USB to operate at up to 10 Gbps. This latest release of the specification will be available
today for download from the USB Implementers Forum (USB-IF) website.

SuperSpeed USB 10 Gbps uses a more efficient data encoding and will deliver more than
twice the effective data through-put performance of existing SuperSpeed USB over
enhanced, fully backward compatible USB connectors and cables. Compatibility is assured
with existing USB 3.0 software stacks and device class protocols as well as with existing 5
Gbps hubs and devices and USB 2.0 products.

Developers interested in implementing the new USB 3.1 Specification have the opportunity
to learn technical details during three developer conferences currently being planned. The
international conferences planned in Europe and Asia will offer more advanced system
design training as breakout sessions on the second day. For more details and conference
registration instructions, please visit the USB-IF website.

1. USB 3.1 Developers Day US – August 21, 2013 in Hillsboro, Ore.
2. USB 3.1 Developers Days Europe – October 1-2, 2013 in Dublin, Ireland
3. USB 3.1 Developers Days Asia – Two day conference scheduled for early December
2013, more details to follow

"The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation
for speed scaling along with defining the next higher physical layer speed as 10 Gbps," said
Brad Saunders, USB 3.0 Promoter Group Chairman. "The specification team worked hard to
make sure that the changes made to support higher speeds were limited and remained
consistent with existing USB 3.0 architecture to ease product development."

"We recognize this advancement in USB technology is an important development for our
customers," said Tom Bonola, Chief Technology Officer, Business PC Solutions, HP. "The
USB 3.1 Specification enables us to meet the growing needs of our customers for faster
data transfer while maintaining backwards compatibility with existing devices."

"The industry has affirmed the strong demand for higher through-put, for user-connected
peripherals and docks, by coming together to produce a quality SuperSpeed USB 10 Gbps
specification," said Alex Peleg, Vice President, Intel Architecture Group. "Intel is fully
committed to deliver on this request."

"While maintaining backward compatibility, USB continues to advance to meet customer's
growing need for higher speed data" said Roland Sperlich, TI Consumer and Computing
Interface Product Line Manager. "The 10 Gbps data rate allows designers across many
industries to do more with a universal standard."

"In this multi-device world, the USB 3.1 updates will enable end-users to move content
across devices quickly, conveniently and without worrying about compatibility," said Emile
Ianni, Corporate Vice President of Platform Solutions Engineering, AMD. "AMD thanks our
engineers as well as the other technology contributors for bringing to market robust
innovation that is designed to work seamlessly with new and existing solutions."

Techgear Team